The Inclusive Engineering Consortium is a culmination of nearly two decades of collaboration between historically minority serving institutions.


  • 1999


    The Mobile Studio Project (RPI), with funding from NSF, Hewlett-Packard, and Analog Devices, demonstrated improved learning through hands-on activities enabled by personal instrumentation. Howard and Rose-Hulman were early partners.

  • 2008


    The LESA ERC brought RPI, Howard, and Morgan State together on research and education

  • 2009


    LESA and Intel provided funding to bring together all 13 HBCUs with ECE programs for a meeting of which 11 additional HBCUs were introduced to Mobile Studio Pedagogy

  • 2012


    NSF was consulted on how best to expand this development of new pedagogy to HBCU ECE programs and they encouraged all 13 schools to submit a joint proposal. 

  • 2012-2016


    Mobile Hands-On STEM merged Mobile Studio with TESSAL (Georgia Tech) and Lab-In-A-Box (Virginia Tech) to advance the use of personal instrumentation

  • 2013-2018


    The NSF HBCU ECP program, with its 13 collaborators, was the first program of this scale, resulting in fundamental changes in how ECE education is offered. This group is a model for how minority serving schools can work together productively.

  • 2019


    The success of the HBCU-ECP Program led to the formalization of the Inclusive Engineering Consortium (IEC)

    Inclusive Engineering Consortium
    Two Prudential Plaza
    180 North Stetson Avenue, Suite 3500
    Chicago, Illinois 60601

    Phone: 773-456-9002

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