History
The Inclusive Engineering Consortium is a culmination of nearly two decades of collaboration between historically minority serving institutions.
Timeline
1999
The Mobile Studio Project (RPI), with funding from NSF, Hewlett-Packard, and Analog Devices, demonstrated improved learning through hands-on activities enabled by personal instrumentation. Howard and Rose-Hulman were early partners.
2008
The LESA ERC brought RPI, Howard, and Morgan State together on research and education
2009
LESA and Intel provided funding to bring together all 13 HBCUs with ECE programs for a meeting of which 11 additional HBCUs were introduced to Mobile Studio Pedagogy
2012
NSF was consulted on how best to expand this development of new pedagogy to HBCU ECE programs and they encouraged all 13 schools to submit a joint proposal.
2012-2016
Mobile Hands-On STEM merged Mobile Studio with TESSAL (Georgia Tech) and Lab-In-A-Box (Virginia Tech) to advance the use of personal instrumentation
2013-2018
The NSF HBCU ECP program, with its 13 collaborators, was the first program of this scale, resulting in fundamental changes in how ECE education is offered. This group is a model for how minority serving schools can work together productively.
2019
The success of the HBCU-ECP Program led to the formalization of the Inclusive Engineering Consortium (IEC)
Inclusive Engineering Consortium
Two Prudential Plaza
180 North Stetson Avenue, Suite 3500
Chicago, Illinois 60601
Phone: 773-456-9002
info@iec.org