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Design and Test for Multiple Gbps Communication Devices and Systems
Format: Soft-Cover or CD-ROM, 497 pages
ISBN: 978-1-931695-34-3
Price: $80.00
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Table of Contents
Part I: Overview
High-Speed I/O Design and Test Review: From the Perspectives of Moore's Law and Multiple Gbps Data Rates
Author: Mike Peng Li, Wavecrest Corp.
Part II: System Architecture and Performance
Transfer Functions for the Reference Clock Jitter in a Serial Link: Theory and Applications
Authors:
Mike Peng Li, Wavecrest Corp.
Andy Martwick, Intel Corp.
Gerry Talbot, AMD
Jan Wilstrup, Teradyne, Inc.
Channel Compliance Testing Utilizing Novel Statistical Eye Methodology
Authors:
Anthony Sanders, Infineon Technologies
Mike Resso, Agilent Technologies
John D'Ambrosia, Tyco Electronics
Advances in High-Speed Design in Dispersively Attenuating Environments Such as Cables and Backplanes
Authors:
Timothy Hochberg, AtSpeed Technologies
Henri Merkelo, AtSpeed Technologies
Mike Resso, Agilent Technologies
Part III: Design Simulation and Modeling
Static Crosstalk Analysis
Author:
Sameer Kalucha, Synopsys, Inc.
Modeling Loss and Jitter in High-Speed Serial Connects
Author: Dennis Miller, Intel Corp.
Design and Modeling Methodology for High-Performance Power Distribution Systems
Authors:
Nam Pham, IBM Corp.
Moises Cases, IBM Corp.
Daniel de Araujo, IBM Corp.
Erdem Matoglu, Georgia Institute of Technology
Bhyrav Mutnury, Georgia Institute of Technology
Madhavan Swaminathan, Georgia Institute of Technology
Source Synchronous Bus Design and Timing Analysis for High-Volume Manufacturable System Interconnects
Authors:
Ahmed Omer, Intel Corp.
Maynard Falconer, Intel Corp.
Part IV: Design for High Performance
Eye Opening Techniques Enabled by Dispersion Compensation
Author:
Kevin Voegele, Applied Micro Circuits Corp.
Maximizing 10-Gbps Transmission Path Length in Copper Backplanes with and without Transceiver Technology
Author:
James Clink, Winchester Electronics
How to Make Optimal Use of Signal Conditioning in 40-Gbps Copper Interconnects
Authors:
Jan De Geest, FCI
Jim Nadolny, FCI
Stefaan Sercu, FCI
Design of a 6.25-Gbps Backplane SerDes with Top-Down Design Methodology
Authors:
Song Wu, Texas Instruments, Inc.
Sridhar Ramaswamy, Texas Instruments, Inc.
Bhavesh Bhakta, Texas Instruments, Inc.
Paul Landman, Texas Instruments, Inc.
Robert Payne, Texas Instruments, Inc.
Vikas Gupta, Texas Instruments, Inc.
Bharat Parthasarathy, Texas Instruments, Inc.
Seema Deshpande, Texas Instruments, Inc.
Wai Lee, Texas Instruments, Inc.
A Flexible Serial Link for 5-10 Gbps in Realistic Backplane Environments
Authors:
Jared Zerbe, Rambus Inc.
Carl Werner, Rambus Inc.
Ravi Kollipara, Rambus Inc.
Vladimir Stojanovic, Rambus Inc.
Part V: Characterization and Test
Signal Integrity and Jitter: How to Measure Them Correctly
Authors:
Mike Peng Li, Wavecrest Corp.
Jan Wilstrup, Wavecrest Corp.
A Statistical and System Transfer Function Based Method for Jitter and Noise in Communication Design and Test
Authors:
Mike Peng Li, Wavecrest Corp.
Jan Wilstrup, Wavecrest Corp.
Total Jitter Measurement at Low Probability Levels, Using the Optimized BERT Scan Method
Authors:
Marcus Müller, Agilent Technologies
Ransom Stephens, Agilent Technologies
Russ McHugh, Agilent Technologies
Comparison and Correlation of Signal-Integrity Measurement Techniques
Authors:
John Patrin, Wavecrest Corp.
Mike Peng Li, Wavecrest Corp.
Performance Evaluation of High-Speed Serial Links
Authors:
Bilal Ahmad, Cisco Systems, Inc.
Jeff Cain, Cisco Systems, Inc.
Physical-Layer Design and Characterization of a 3.2 Gbps/Pair Memory Channel
Authors:
Wendem T. Beyene, Rambus Inc.
Chuck Yuan, Rambus Inc.
Newton Cheng, Rambus Inc.
Hao Shi, Rambus Inc.
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