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Signal Integrity—Multi-Gigabit Transmission over Backplane Systems
Sponsored by:
Teradyne

Table of Contents:
Definition and Overview
1. Board Launch
2. Stub
3. Materials
4. Widths
Self-Test
Glossary
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Self-Test
1. For the study presented in this tutorial, a _____________ Gbps range was chosen as the data rate for sample system comparison.
a. 1.25 – 7.0
b. 2.5 – 12.0
c. 3.5 – 10.0
d. 12.0 – 40.0
2. Electrical characterization of high-speef connectors is typically reported as...
a. Connector/launch impedance
b. Interpair/crosstalk
c. Both of the above
d. None of the above
3. Which of the following is NOT mentioned as a common type of connector launch?
a. Plated through hole
b. Laser drilled micro via
c. Pad/drilled via
4. One method of improving PCB hole impedance is to expand the anti-pads in the ground planes of the boards.
a. True
b. False
5. According to this study, at the 50% power point, exotic laminates offered additional bandwidth of approximately _________.
a. 12 GHz
b. 6 GHz
c. 2 GHz
d. 4 GHz
6. When referring to passive back plane systems the GBx daughter card uses non-circular clearance.
a. True
b. False
7. With regard to signal path options, which of the following is a length consideration of the OC–192 Card Inner Signal Layer?
a. High speed traces
b. Total System Trace Length
c. RO–4003 material
8. The intent of this tutorial is to provide a detailed study of trace topology and high-speed backplane connectors.
a. True
b. False

Glossary >>

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