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Practical Guidelines for the Implementation of Back Drilling Plated Through Hole Vias in Multi-gigabit Board Applications
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PDF of this tutorialGlossary
Acronyms Guide
BERT - Bit-Error Rate Test
CDR - Clock Data Recovery
Gbps - Gigabits per second
Gb/s - Teradynes newest high-speed, high-density connector
PCB - printed circuit board
PRESMT - press-fit surface-mount technology
PTH - plated-through hole
PWB - printed wiring board
SISMT - semi-intrusive surface-mount technology
TCE - temperature coefficients of expansion
TDR - time domain reflectometer
TDT - time domain transmission
VHDM-HSD - VHDM technology optimized for high-speed differential (HSD) applications
VHMD® - Teradynes very–high density metric connector
VNA - vector network analyzer
