Connecting Chips, Connecting Engineers
Starting off 2008 in Silicon Valley, the IEC presents DesignCon 2008 February 4–7 in Santa Clara, California. DesignCon is the annual event for the electronic-design and semiconductor industries. Follow along with next week's conference highlights, which will include product announcements and compelling technical paper discussions.
Featured Keynote AddressFeatured Keynote Address
Industry leaders' insights from DesignCon 2007
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Leah Jamieson
John A. Edwardson Dean of Engineering, College of Engineering
Purdue University
IEEE 2008 Past President
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Executive Perspective
One-on-one interviews with industry leaders
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 Doug Williams
nm2 Project Director
BT Chief Technology Office
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Technology Briefing
White papers covering news, studies, and trends
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This issue's Technology Briefings feature DesignCon Paper Award recipients. Design Paper Awards recognize outstanding contributions to the educational goals of the DesignCon program. |
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Content by:
Graham Allan, MOSAID Technologies
Jody Defazio, MOSAID Technologies
SoC designers face an increasingly daunting task when they are required to develop an SoC that requires a DDR SDRAM interface. Problems include the requirement for both ASIC and mixed-signal design flows, complex verification, intimacy with the DRAM components (and the road maps), and short chip life cycles and time to market.
Fortunately, there is a semiconductor IP solution that addresses these problems and reduces development costs as well.
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Content by:
Mark Bailey, IBM Technology Collaboration Solutions
Greg Edlund, IBM Technology Collaboration Solutions
Bob Morse, Mercury Computer Systems
Ankur Patel, IBM Technology Collaboration Solutions
This paper looks at the tradeoffs between power, cooling, and performance involved in packaging the cell broadband engine, multi-core graphics processor, and associated bridge chip on a PCI ExpressTM card together with large amounts of memory.
In particular, it focuses on AC and DC power distribution to more than 20 domains, PCI Express compliance, and timing specifications for a DDR2 interface.
Media Spotlight
Design for Profitability: What DFP Means for PCB Designers
Content by: Andy Shaughnessy, Editor, Design007
"Design for manufacturability (or DFM) has become a household phrase in the PCB industry. But design for profitability (or DFP) must also be taken into account. Ultimately, DFP may be the most important consideration of all" Read full article »
Web ProForum
Tutorials featuring the latest technical and business issues
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The telecommunications market has changed dramatically since the SS7 network's inception. Deregulation and convergence have moved the industry beyond a relatively small group of carriers and equipment manufacturers.
These changing market dynamics have left the door open to an inadvertent or malicious disruption, phantom/misrouted call abuse, and fraud-catalyzing the need for an access mediation device to mitigate these risks. |
Definition and Overview |
Analyst Corner
Perspectives from leading information industry experts
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Just as telcos are launching new services-primarily content-based-to satisfy end-user demand and offer more choices in the marketplace, they have another customer opportunity-they can offer advertisers a targeted, intimate, and interactive platform for advertising messages.
Content by: Susan Tucker, Managing Consultant, Detecon Susannah Spellman, Senior Consultant, Detecon Corinna Schramme, Business Analyst, Detecon |
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