In This Issue: Design Engineering and More
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Learn about some of the latest design engineering thoughts and developments as the IEC presents DesignCon 2007 January 29 – February 1 in Santa Clara, California.
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Executive PerspectivesExecutive Perspectives
Critical insights from key industry leaders
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Ofer Reviv VP, Marketing and Sales, Broadband Access Division
ECI Telecom Captured at the Broadband World Forum Europe 2006 |
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Ofer Reviv shares his executive perspective on how carriers will make money by implementing converged networks; how he sees IMS and the wireless competition affecting ECI Telecom; his response to analysts who say IPTV is not sustainable in and of itself; how he views the market for IPTV and the telecom market in five years; and more.
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Mike Quigley President and Chief Operating Officer
Alcatel Captured at the Broadband World Forum Europe 2006 |
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Mike Quigley discusses his keynote address at Broadband World Forum Europe 2006, titled "Service-Led Transformation"; Alcatel's latest product developments such as the award-winning Digital Home-Care Solution; Alcatel's 1850 transport service switch (TSS), Alcatel's progress, plans, and vision; and more.
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Technology Briefing
Design Engineering I:
Addressing the Unique Thermal Management Challenges of Mobile Devices
Educational content provided by Chris Hill, NXP Semiconductors
Thermal simulation of mobile devices follows the same general procedures as stationary devices, but there are some significant differences. This article will discuss the thermal management challenges of the new generation of smaller, more powerful mobile devices and provide some suggestions for identifying and solving thermal problems prior to the prototyping phase.
Read full article...
Design Engineering II:
The Triple-Play Challenge – Driving the Need for Flexible Programmable Silicon Solutions
Educational Content provided by Wim Roelandts, Xilinx, Inc. and VSI Alliance
It is clear that the fundamental business dynamics associated with triple play will drive strong business growth and serve as a key catalyst that will drive continued investments in the Internet infrastructure. Just as programmable logic has already played a key role in the initial build out of the Internet infrastructure, the benefits and capabilities of FPGAs will play an even greater role as triple play comes to every household. Read full article...
Broadband Trends:
Intelligent Networks Pave the Way for Service Optimization
Educational content provided by Allot Communications
Under pressure to boost revenue, maintain customer loyalty, and deploy new services? Read how using a deep packet inspection technology can help identify, analyze, and manage traffic and user types on the network to attain expected levels of service quality. Read full article...
Media Spotlight:
Embedded Resistance and Capacitance in One PCB Material
Educational content provided by PCB007
Oak-Mitsui and Ohmega Technologies have just been granted a brand-new patent that could give embedded-materials users exactly what they have been wishing for—a lower-cost embedded resistance/capacitance solution. Read full article...
Analyst Corner
The Analyst Corner features perspectives from a range of leading information industry experts.
Tom Flanagan
Director, Technical Strategy, DSP Systems
Texas Instruments
Director, Technical Strategy, DSP Systems
Texas Instruments
Debbie Greenstreet
Director, Service Provider Marketing, DSP Systems
Texas Instruments
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