The International Engineering Consortium (IEC) is pleased to provide you with the following Broadband World Forum Asia logos. These logos are made available to assist companies in highlighting their involvement in the Broadband World Forum Asia and are to be used only in conjunction with marketing materials and communications promoting your involvement in the event.

For printed materials, all logos should always have at least 0.75" of clear space around them to separate them from surrounding elements. All logos may be reproduced only as submitted and may not be altered in any way.