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International Engineering Consortium
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Press Releases
FOR IMMEDIATE RELEASE
U.S. Contact: Kim Simpao
IEC's DesignCon 2010 Conference and Exhibition Attracts Thousands of Design Engineers, Top Vendors, and Industry Leaders The International Engineering Consortium (IEC) wraps up a successful DesignCon 2010 with its featured IP Summit and inaugural PCB Summit programs CHICAGO - March 2, 2010 – The International Engineering Consortium today announced the winners of the 2010 DesignCon Paper Awards in recognition for their outstanding contributions to the educational goals of DesignCon 2010. "We are very pleased that DesignCon has such strong support and enthusiasm from the design engineering community and continues to deliver the high-quality program that attendees have come to expect both in the classroom and on the exhibit floor," commented IEC President John Janowiak. "It is this kind of energy that brings attendees back year after year to network with their peers and to learn about the latest solutions the industry has to offer." Next year's DesignCon takes place January 31-February 3, 2011 at the Santa Clara Convention Center in Santa Clara, California. Kevin Donnelly, Senior Vice President, IP Strategy, Rambus will serve as the IP Summit Chair and John Andresakis, Vice President of Strategic Technology, Oak Mitsui will serve as the PCB Summit Chair. The DesignCon 2011 planning meeting takes place April 13-14, 2010, at the Santa Clara Convention Center. All interested industry professionals and stakeholders are invited to join. For complete information, visit http://www.designcon.com or contact Kim Simpao at ksimpao@iec.org or +1-773-315-7779. ### About the IEC In conjunction with industry—leading companies, the IEC has developed an extensive, free, on—line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age. More than 70 leading high—technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org |
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