DesignCon 2007 Exhibition Plays Host to Hundreds of Cutting-Edge Design Tools This Month in Santa Clara

CHICAGO – Jan. 17, 2007 – The International Engineering Consortium (IEC) hosts a record-breaking number of exhibitors at DesignCon 2007, which takes place this January 29 through February 1 at the Santa Clara Convention Center in Santa Clara, California.

IEC President John Janowiak commented, "Our growing exhibition floor once again has a record-breaking number of exhibitors with an added group of exciting new companies. And dedicated to continuing education, we are thrilled to present the Exhibits Plus Pass to all industry professionals, which grants full and complimentary access to the entire exhibition, keynote addresses, along with plenary and technical panels and receptions."

Major sponsors exhibiting at DesignCon include Agilent Technologies (official sponsor), RAMBUS, Inc., LeCroy Corporation, Tektronix, Inc., BERTScope, Computer Simulation Technology, Sigrity, Inc., ANSOFT Corporation, Molex, MOSAID Technologies, Samtec and REED Electronics Group.

The DesignCon exhibition features leading organizations presenting EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies and more.

Exciting new companies joining the DesignCon exhibition include Accurel Systems, Anritsu Company, ANSYS, Inc., Appro, Arch Pro Design Automation, Inc., ASSET InterTech, Inc., Bogatin Enterprises, CA Design, Carbon Design Systems, Cascade Microtech, ChipEDA, Chip Estimate, Coretec, Corning Gilbert, Inc., Coverity, DuPont Electronic Technologies, Flomerics, Inc., FuturePlus Systems, Innov-x Systems, Inc., Memcore, Inc., Merix Corporation, Mixel, NCI Logic Analyzers, NEL Frequency Controls, Nicomatic, Noise Com, Oak-Mitsui Technologies, Paricon Technologies Corporation, Perfectus Technology, Rosenberger of North America, LLC, San Francisco Circuits, Semiconductor Store/Symmetry Electronics, Simberian, Inc., Solarflare Communications, Inc., Springer Science + Business Media, LLC, Starnet and TES Electronic Solutions.

The DesignCon exhibition also features three Technology Pavilions this year, providing attendees with hands-on demonstrations in specific technology areas such as semiconductor and IP, PCB and verification.

Also on the floor are the DesignCon poster sessions, which will be presented by industry authors during the exhibition floor evening reception on Tuesday and Wednesday. Poster topics include 3D packaging technologies, advanced interconnect technologies, system-in-package (SiP) design and wafer-level testing.

The TecPreview theater takes the stage, previewing some of the latest industry advancements using multimedia. Presenters include BERTScope, CA Design, eASIC, FuturePlus Systems, LeCroy Corporation, NEL Frequency Controls, Inc., Samtec, SiSoft, Synplicity, Inc. and Tektronix, Inc. More information on TecPreviews can be found at www.designcon.com/2007/exhibition/tecpreviews.html.

The annual DesignTOUR also takes place at the show, adding another exciting element. High-tech prizes fitting the theme of DesignCon will be given away to attendees from DesignCon sponsors such as Agilent Technologies, BERTScope, LeCroy Corporation, Molex, MOSAID Technologies, Rambus, Inc., Samtec and Tektronix, Inc.

Also on this year's DesignCon exhibition floor will be the newly announced DesignVision Awards, recognizing the most successful design tools released in 2006. Many of the industry's best innovators in electronic design will share their latest developments with attendees.

Industry professionals can preview these and many other hot technologies in the Exhibitor Product Guide, available at www.designcon.com/2007/exhibition/exh_product_guide.html.

DesignCon's full exhibitor listing is available at www.designcon.com/2007/exhibition/exh_list.html.

For complete information, visit www.designcon.com/2007 or contact Lisa Reyes at lreyes@iec.org or +1-312-559-3325.

About DesignCon
DesignCon serves as the premier event for practicing engineers in the electrical design and semiconductor communities. Broadening the scope to address business as well as technical issues of the industry, DesignCon 2006 hosted 125 exhibiting companies and drew more than 5,000 industry professionals to register. This year's DesignCon will host more than 300 industry experts to speak in more than 100 educational tutorials, plenary panels, paper presentations, and sessions at DesignCon. Complementing the conference, more than 125 exhibitors are expected to take the floor exhibiting the latest technological developments. Visit www.designcon.com/2007.

About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. The IEC also manages the activities of the Enterprise Communications Consortium. Visit www.iec.org.