International Engineering Consortium
Call for Newsletter Articles
Newsletter: Technology Briefiings
Submit Your Article to the IEC Newsletter and Gain Recognition as an Expert Contributor

Be published alongside industry leaders in the Technology Briefing section of the IEC Newsletter.

View Current Newsletter »

Articles may include, but are not limited to, company white papers, noncommercial case studies, and noncommercial educational content generated by your company.

When published, your company will be presented as an industry resource on that particular topic with a corresponding link to your company's Web site. With a reach of nearly 700,000 industry professionals and students worldwide, your company will receive exposure to a unique new audience.

This is a complimentary opportunity. Article submissions are accepted in Word and should be approximately 1,500 words with a 75-word summary. The article must be noncommercial, and we will grant final approval.

To submit an article for consideration, contact:

Rachel Loebl
rloebl@iec.org
+1-312-559-4607

Examples of acceptable subjects:
(not meant to be all-inclusive)
Broadband
  • IPTV
  • Mobile broadband
  • Fixed-mobile convergence/IMS
  • Emerging services
  • Content applications
  • Next-generation access
  • IP network evolution
  • The digital home
  • Ethernet over IP/MPLS
  • OAM issues
  • Convergence of optical and carrier Ethernet
  • Ethernet as NG transport
  • Ethernet over copper
  • All-optical networks
  • Enterprise, next-generation access to NGNs (including end-to-end business and technology issues)
  • Network and services management
  • DRM (copyright, privacy, licensing, and security)
  • User-generated content (social networking, video, audio, publishing)
  • Content aggregation (distributors and publishers)
  • The digital divide
 
Design Engineering
  • Design for manufacturing
  • Electronic system-level design
  • Intellectual property (IP) management
  • High-speed interconnect design
  • Automotive electronics
  • Wireless devices
  • IC design
  • PCB design
  • High-performance interconnects
  • Design verification
  • Power management
  • Test and measurement
  • Business of electronic design

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